X頻段平面式高功率整合技術設計研製

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	何東叡	en_US
dc.contributor.author	He, Tung-Jui	en_US
dc.contributor.author	張志揚	en_US
dc.contributor.author	Chang, Chi-Yang	en_US
dc.date.accessioned	2014-12-12T02:42:47Z	-
dc.date.available	2014-12-12T02:42:47Z	-
dc.date.issued	2013	en_US
dc.identifier.uri	http://140.113.39.130/cdrfb3/record/nctu/#GT070160287	en_US
dc.identifier.uri	http://hdl.handle.net/11536/75238	-
dc.description.abstract	本論文對於X頻段之固態功率放大器模組提出設計概念，進行系統需求之分析，並提出功率放大器模組整體系統結構，包括前級放大器、高功率放大器元件、功率整合架構，針對高功率放大器元件之特性進行實作電路板及量測。本論文將針對功率放大器模組中的平面式功率整合架構進行設計、分析與電磁模擬，並執行實體電路的製作與量測，包括一分二功率分配器、二合一功率合成器、一分四功率分配器、四合一功率合成器，本論文使用Taconic RF-35PTM、板厚20 mil之板材進行設計與實作。	zh_TW
dc.description.abstract	This thesis discusses the conceptual design of a solid-state power amplifier in X band, and proposes the system structure of power amplifier module, including pre-amplifiers, high power amplifier devices, power combining structure. Some components of power combining structure would be designed, simulated, analyzed on microstrip line, including two-way power divider/combiner, four-way power divider/combiner. The practical circuits are implemented with a 20mil thick Taconic RF-35PTM substrate.	en_US
dc.language.iso	zh_TW	en_US
dc.subject	功率合成器	zh_TW
dc.subject	功率分配器	zh_TW
dc.subject	高功率	zh_TW
dc.subject	power divider	en_US
dc.subject	power combiner	en_US
dc.subject	high power	en_US
dc.title	X頻段平面式高功率整合技術設計研製	zh_TW
dc.title	X Band Planar Transmission Line High Power Combining Technology	en_US
dc.type	Thesis	en_US
dc.contributor.department	電信工程研究所	zh_TW
顯示於類別：	畢業論文