標題: Investigation of Ni-based thermal bimaterial structure for sensor and actuator application
作者: Huang, Chia-Sheng
Cheng, Yu-Ting
Chung, Junwei
Hsu, Wensyang
機械工程學系
電子工程學系及電子研究所
Department of Mechanical Engineering
Department of Electronics Engineering and Institute of Electronics
關鍵字: Bimaterial structure;Bimorph;Electroplating;Nanocomposite
公開日期: 16-二月-2009
摘要: Thermal bimaterial structures made of Ni and Ni-diamond nanocomposite for sensor and actuator application are proposed, fabricated, and tested. Two deflection types of thermal bimaterial structures, including upward and downward bending types, can be easily fabricated by controlling electroplating sequence of Ni and Ni-diamond nanocomposite. According to thermal performance measurement, the tip deflection of upward and downward types can reach about 82.5 mu m and -22.5 mu m for a temperature change of 200 degrees C, respectively. In the condition, the thermomechanical sensitivity and Output force are 412.5 nm/K and 97.0 mu N for upward type thermal bimaterial structure: and -112.5 nm/K and -26.5 mu N for downward type one. Due to the low electroplating process temperature (similar to 50 degrees C) for both Ni-based layers, diminutive pre-deformation of as-fabricated structure and strong interlaminar bonding strength are verified by SEM and vibrational test. The resonant frequency of the structure remains unchanged after 10(9) cycles. (C) 2008 Elsevier B.V. All rights reserved.
URI: http://dx.doi.org/10.1016/j.sna.2008.11.019
http://hdl.handle.net/11536/7622
ISSN: 0924-4247
DOI: 10.1016/j.sna.2008.11.019
期刊: SENSORS AND ACTUATORS A-PHYSICAL
Volume: 149
Issue: 2
起始頁: 298
結束頁: 304
顯示於類別:期刊論文


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