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dc.contributor.author曾齡誼en_US
dc.contributor.authorTseng, Ling-Yien_US
dc.contributor.author謝建文en_US
dc.contributor.authorHsieh, Chien-Wenen_US
dc.date.accessioned2014-12-12T02:45:19Z-
dc.date.available2014-12-12T02:45:19Z-
dc.date.issued2014en_US
dc.identifier.urihttp://140.113.39.130/cdrfb3/record/nctu/#GT070158130en_US
dc.identifier.urihttp://hdl.handle.net/11536/76332-
dc.description.abstract有機半導體材料因為可以使用低成本溶液製程,所以被廣泛應用於有機薄膜電晶體。電晶體可藉由縮短通道提高電性效能,而垂直式電晶體實現這個想法。有機電晶體的性能與聚合物薄膜的結構排列息息相關,聚(3-己烷噻吩)(P3HT)能透過SAM有顯著的有序結構。為了能有效控制分子排列方向(平行基板排列),並且運用於垂直式電晶體上。我們將單種與複合材料包埋在樹酯裡,並且使用超薄切片機進行奈米切片,再將切片進行堆疊。在本實驗裡,我們成功將不同種類切片堆疊。接下來希望能將此技術改善並廣泛運用於奈米結構與元件製作。zh_TW
dc.description.abstractOrganic semiconductor materials have been widely used in the field of organic electronics because they lead to low-cost solution-base fabrication. Transistors, particularly vertical-type ones, can improve electrical performance through their reduced channel length. This property of the organic transistor is related to structural arrangement. Poly(3-hexylthiophene) can achieve a significantly ordered structure through SAM treatment. To effectively control the molecular orientation (parallel to the substrate) and apply it to a vertical transistor, we embedded single and complex materials into resin and used the ultramicrotome (for nanoskiving) to section the materials into slices before stacking. In this experiment, we successfully stacked the slices with different kind of slices. We intend to improve this technology and use it extensively in nanostructure production and device fabrication.en_US
dc.language.isoen_USen_US
dc.subject奈米超薄切片zh_TW
dc.subject聚噻吩共軛高分子zh_TW
dc.subject垂直式電晶體zh_TW
dc.subjectNanoskivingen_US
dc.subjectP3HTen_US
dc.subjectVertical-Type Transistorsen_US
dc.title由奈米切片技術構成高分子複合奈米線之有機電子zh_TW
dc.titleFormation of Polymer and Composite Nanowires by Nanoskiving Technique for Organic Electronicsen_US
dc.typeThesisen_US
dc.contributor.department照明與能源光電研究所zh_TW
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