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dc.contributor.authorYang, Yu-Linen_US
dc.contributor.authorHou, Fu-Juen_US
dc.contributor.authorWu, Shich-Chuanen_US
dc.contributor.authorHuang, Wen-Hsienen_US
dc.contributor.authorLai, Ming-Chihen_US
dc.contributor.authorHuang, Yang-Tungen_US
dc.date.accessioned2014-12-08T15:10:07Z-
dc.date.available2014-12-08T15:10:07Z-
dc.date.issued2009-01-26en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.3075056en_US
dc.identifier.urihttp://hdl.handle.net/11536/7727-
dc.description.abstractThree-dimensional all metallic photonic crystals with a feature size of 0.20 mu m were fabricated using electron-beam lithography with the photoresist of hydrogen silesquioxane. This process method has high compatibility with the fabrication of damascene copper interconnections and also simplifies the whole process flow. The dependence of the complete photonic band gaps on polarization was experimentally observed and compared with the simulation results. The band edge for the four-layer lattice was found at a wavelength of around 0.80 mu m in normal incidence.en_US
dc.language.isoen_USen_US
dc.subjectcopperen_US
dc.subjectelectron beam lithographyen_US
dc.subjecthydrogen compoundsen_US
dc.subjectinterconnectionsen_US
dc.subjectlight polarisationen_US
dc.subjectoptical interconnectionsen_US
dc.subjectphotonic band gapen_US
dc.subjectphotonic crystalsen_US
dc.titleFabrication and characterization of three-dimensional all metallic photonic crystals for near infrared applicationsen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.3075056en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume94en_US
dc.citation.issue4en_US
dc.citation.epageen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000262971800022-
dc.citation.woscount5-
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