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dc.contributor.authorChang, Mu-Tienen_US
dc.contributor.authorHuang, Po-Tsangen_US
dc.contributor.authorHwang, Weien_US
dc.date.accessioned2014-12-08T15:10:09Z-
dc.date.available2014-12-08T15:10:09Z-
dc.date.issued2007en_US
dc.identifier.isbn978-1-4244-1592-2en_US
dc.identifier.urihttp://hdl.handle.net/11536/7756-
dc.description.abstractGain cell memories feature high speed, low power, and high density, which are suitable for SoC designs. In this paper, low power techniques to reduce leakage currents for 2T1D gain cell memory array are presented. For each memory cell, p-type gated diode storage device is applied. In addition, footer power gating and foot driver are applied on each memory word. Simulation results show that the proposed 2T1D memory array structure has 97.7% and 80% standby power reduction over typical 2T1D and typical 3T1D memory array, respectively. All the simulation results are based on Predictive Technology Model (PTM) 65nm CMOS bulk technology.en_US
dc.language.isoen_USen_US
dc.titleA 65nm low power 2T1D embedded DRAM with leakage current reductionen_US
dc.typeArticleen_US
dc.identifier.journal20TH ANNIVERSARY IEEE INTERNATIONAL SOC CONFERENCE, PROCEEDINGSen_US
dc.citation.spage207en_US
dc.citation.epage210en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000257572200047-
顯示於類別:會議論文