Routing for Manufacturability and Reliability

Full metadata record

DC Field	Value	Language
dc.contributor.author	Chen, Huang-Yu	en_US
dc.contributor.author	Chang, Yao-Wen	en_US
dc.date.accessioned	2014-12-08T15:10:10Z	-
dc.date.available	2014-12-08T15:10:10Z	-
dc.date.issued	2009	en_US
dc.identifier.issn	1531-636X	en_US
dc.identifier.uri	http://hdl.handle.net/11536/7763	-
dc.identifier.uri	http://dx.doi.org/10.1109/MCAS.2009.933855	en_US
dc.description.abstract	As IC process geometries scale down to the nanometer territory, industry faces severe challenges of manufacturing limitations. To guarantee high yield and reliability, routing for manufacturability and reliability has played a pivotal role in resolution and thus yield enhancement for the imperfect manufacturing process. In this article, we introduce major routing challenges arising from nanometer process, survey key existing techniques for handling the challenges, and provide some future research directions in routing for manufacturability and reliability.	en_US
dc.language.iso	en_US	en_US
dc.title	Routing for Manufacturability and Reliability	en_US
dc.type	Article	en_US
dc.identifier.doi	10.1109/MCAS.2009.933855	en_US
dc.identifier.journal	IEEE CIRCUITS AND SYSTEMS MAGAZINE	en_US
dc.citation.volume	9	en_US
dc.citation.issue	3	en_US
dc.citation.spage	20	en_US
dc.citation.epage	31	en_US
dc.contributor.department	交大名義發表	zh_TW
dc.contributor.department	National Chiao Tung University	en_US
dc.identifier.wosnumber	WOS:000270433000003	-
dc.citation.woscount	1	-
Appears in Collections:	Articles

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