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dc.contributor.authorTseng, S. -C.en_US
dc.contributor.authorMeng, C. C.en_US
dc.contributor.authorLiao, H. -Y.en_US
dc.contributor.authorLin, Y. -C.en_US
dc.contributor.authorTeng, Y. -H.en_US
dc.date.accessioned2014-12-08T15:10:12Z-
dc.date.available2014-12-08T15:10:12Z-
dc.date.issued2009-01-01en_US
dc.identifier.issn0895-2477en_US
dc.identifier.urihttp://dx.doi.org/10.1002/mop.23968en_US
dc.identifier.urihttp://hdl.handle.net/11536/7793-
dc.description.abstractA 5.2 GHz 0.18-mu m SiGe BiCMOS low noise amplifier is implemented with guided-wave interconnections in this letter. These interconnections reduce the substrate skin and proximity effects and hence are suitable for high frequency circuits. The guided interconnections bring 1.7-dB gain and 0.55-dB noise figure enhancement for the low noise amplifier. In addition, accurate and simple design methodology relies on the complete models of components and interconnections when the poststimulation from the rc extraction is not enough for the high,frequency circuit design. The measurement results give excellent agreements with the schematic simulation. (C) 2008 Wiley Periodicals, Inc. Microwave Opt Technol Lett 51: 144-146, 2009; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.23968en_US
dc.language.isoen_USen_US
dc.subjectCPWGen_US
dc.subjectinterconnectionen_US
dc.subjectlow noise amplifieren_US
dc.subjectSiGe BiCMOSen_US
dc.titleINTERCONNECTION LOSS FROM SUBSTRATE EFFECTS ON LNA PERFORMANCE AND DESIGN ACCURACYen_US
dc.typeArticleen_US
dc.identifier.doi10.1002/mop.23968en_US
dc.identifier.journalMICROWAVE AND OPTICAL TECHNOLOGY LETTERSen_US
dc.citation.volume51en_US
dc.citation.issue1en_US
dc.citation.spage144en_US
dc.citation.epage146en_US
dc.contributor.department電信工程研究所zh_TW
dc.contributor.departmentInstitute of Communications Engineeringen_US
dc.identifier.wosnumberWOS:000261625900041-
dc.citation.woscount0-
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