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dc.contributor.author許旭昌en_US
dc.contributor.author陳仁浩en_US
dc.date.accessioned2014-12-12T02:53:41Z-
dc.date.available2014-12-12T02:53:41Z-
dc.date.issued2005en_US
dc.identifier.urihttp://140.113.39.130/cdrfb3/record/nctu/#GT009314518en_US
dc.identifier.urihttp://hdl.handle.net/11536/78493-
dc.description.abstract近年來,如何以更大的面積成形具更高深寬比的微小結構一直是塑膠微成形的研究重點,然而在微成形過程的冷卻脫模階段中,往往由於模仁與塑膠成形品彼此的收縮率不同,導致在脫模時產生夾持的現象,造成脫模後微結構變形或受損等。本研究利用數值計算的方法,模擬在微熱壓成形過程中,塑膠成形品與矽模仁在冷卻脫模階段的溫度與應力變化。並且引入熱電阻的觀念,加入微加熱器條件,探討了發熱功率大小、發熱時間點與發熱時間長短對溫度場及熱應力場之影響。最後,整理製作出微熱壓製程中運用微加熱器時的操作窗,可供為選擇熱壓條件之參考。zh_TW
dc.language.isozh_TWen_US
dc.subject熱壓成形zh_TW
dc.subject模擬zh_TW
dc.subjecthot embossingen_US
dc.subjectsimulationen_US
dc.title微熱壓成形之溫度模擬與應力分析zh_TW
dc.titleThe Simulation of Temperature and Stress on the Micro Hot-Embossing Processen_US
dc.typeThesisen_US
dc.contributor.department機械工程學系zh_TW
Appears in Collections:Thesis


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