化學機械研磨機台製程設備模擬器及控制器之設計與實作

Abstract

本論文主要目的在利用實體迴路(Hardware In the Loop, HIL)的概念，針對半導體製程中的化學機械研磨機台(Chemical Mechanical Polishing, CMP)，設計一套包含模擬器與控制器的平台。研究重點在於利用兩台獨立的工業電腦來設計CMP系統的模擬器與控制器，並以Windows XP及 Window 2000為發展平台，Matlab、BC++ Builder為開發工具，來完成此一架構。

論文中說明化學機械研磨機台的基本架構和主要參數，同時介紹Run To Run EWMA (Exponentially Weighted Moving Average)及FNN (Fuzzy Neural Network)控制模式，建構應用於化學機械研磨的單元控制器，並利用RS-232硬體介面來建構通訊模組將數據回傳做迴饋控制，經由修正製程設備控制系統的控制參數改善其功效。

In this thesis, we will develop a framework including simulator and controller for the Chemical Mechanical Polishing (CMP) equipment in the semiconductor industry by using the concept of Hardware-In-the-Loop (HIL). We use two independent computers to design simulator and controller for CMP process and adopt Matlab、BC++ Builder as the developing tools implemented on the Windows XP and Window 2000 platform.

We explain the basic architecture and the primary parameters for the CMP equipment. We also introduce Run to Run EWMA (Exponentially Weighted Moving Average) and FNN (Fuzzy Neural Network) concept to establish the controller for CMP process and use RS-232 hardware to build the communication module to pass the data back and forth for feedback control. As a result, the control system can be used to continuously improve the performance of the control system.