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dc.contributor.authorLin, Chun-Yuen_US
dc.contributor.authorKer, Ming-Douen_US
dc.date.accessioned2014-12-08T15:02:04Z-
dc.date.available2014-12-08T15:02:04Z-
dc.date.issued2008en_US
dc.identifier.isbn978-1-4244-2039-1en_US
dc.identifier.urihttp://hdl.handle.net/11536/785-
dc.description.abstractLow capacitance (low-C) design on ESD protection device is a solution to mitigate the radio-frequency (RF) performance degradation caused by electrostatic discharge (ESD) protection device. Silicon-controlled rectifier (SCR) device has been used as an effective on-chip ESD protection device in RF ICs due to the smaller layout area and small parasitic capacitance under the same ESD robustness. In this paper, the modified lateral SCR (MLSCR) realized in waffle layout structure is studied to minimize the parasitic capacitance and the variation of the parasitic capacitance within ultra-wide band (UWB) frequencies. With the minimized parasitic capacitance, the degradation on RF circuit performance due to ESD protection devices can be reduced. The waffle MLSCR with low parasitic capacitance is suitable for on-chip ESD protection in UWB RF ICs. Besides, the turn-on speed of MLSCR with waffle layout structure is verified to be better than that with conventional stripe structure.en_US
dc.language.isoen_USen_US
dc.titleOptimization on SCR device with low capacitance for on-chip ESD protection in UWB RF circuitsen_US
dc.typeProceedings Paperen_US
dc.identifier.journalIPFA 2008: PROCEEDINGS OF THE 15TH INTERNATIONAL SYMPOSIUM ON THE PHYSICAL & FAILURE ANALYSIS OF INTEGRATED CIRCUITSen_US
dc.citation.spage58en_US
dc.citation.epage61en_US
dc.contributor.department電機學院zh_TW
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000259140300013-
Appears in Collections:Conferences Paper