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dc.contributor.authorZan, Hsiao Wenen_US
dc.contributor.authorHuang, Chang Yuen_US
dc.contributor.authorSaito, Kazuyaen_US
dc.contributor.authorTamagawa, Kouichien_US
dc.contributor.authorChen, Jacken_US
dc.contributor.authorWu, Tung Jungen_US
dc.date.accessioned2014-12-08T15:10:19Z-
dc.date.available2014-12-08T15:10:19Z-
dc.date.issued2007en_US
dc.identifier.isbn978-1-55899-866-7en_US
dc.identifier.issn0272-9172en_US
dc.identifier.urihttp://hdl.handle.net/11536/7879-
dc.description.abstractThis paper studies the poly-Si crystallization mechanism under the high power (200 W) Nd:YAG solid state pulsed laser annealing system. It is found that the Gaussian-distributed laser beam profile successfully produce large super lateral growth process window. The devices in the SLG process window exhibit an electron field-effect mobility around 250 cm(2)/V.s and a threshold voltage lower than 1 V. The influence of a-Si film thickness and the laser scan pitch on the process window is also carefully investigated.en_US
dc.language.isoen_USen_US
dc.titleThe crystallization mechanism of poly-Si thin film using high-power Nd : YAG laser with Gaussian beam profileen_US
dc.typeProceedings Paperen_US
dc.identifier.journalAmorphous and Polycrystalline Thin-Film Silicon Science and Technology 2006en_US
dc.citation.volume910en_US
dc.citation.spage335en_US
dc.citation.epage340en_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.identifier.wosnumberWOS:000245670700049-
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