塑膠球型柵狀陣列基板(PBGA)的生命週期評估研究

Abstract

PBGA基板為半導體晶片在封裝時所用之主要材料，為IC（Integrated Circuit）晶片對外線路連接橋樑。由於PBGA封裝方式突破原有使用導線架作為晶片對外連接之技術，能更有效率達到高倍數晶片功能，且其厚度較引線架薄，符合電子產品日益輕薄短小及散熱之需求。

PBGA製程中使用大量不同種類的材料及化學原料。本研究以PBGA產品製造工廠為對象，探討PBGA產品之生命週期對環境的影響。研究時採實廠調查的方式，調查工廠原物料投入、生產、污染排放、廢棄物處理等資料，進行生命週期評估及對環境衝撃及影響。本研究並針對不同層數的產品、盤查範疇差異進行研究，進而了解生命週期評估結果之差異性。所使用之生命週期評估軟體為工研院開發Doitpro，並採用Eco-Indicater95為環境衝撃評估模式，將環境衝擊量化。

本研究發現PBGA產業之直間接原物料高達2700餘種，其複雜程度與半導體製造業類似，對環境衝擊最巨者為水資源消耗，次之為能源使用，再次之為固體廢棄物的產生。本研究發現產能尚未達滿載之工廠，需要較高能源消耗，來維持一個生產工廠的正常運作，相對地對環境衝擊較大。再者對多層板產品的研究發現，以單一層數而言，較高層數的產品對原物料的使用及能源消耗依賴度相對減低，亦即對環境負荷及衝擊較少，因此愈高階的產品對環境愈有善，對PBGA產業的發展是正面的。對盤查範疇差異分析發現，占總原物料的70%及80%的盤查資料所得到的衝擊評估結果，與100%盤查資料的誤差低於15%，結果差異不大。亦即表示針對PBGA產品而言，在進行生命週期評估時可將一般要求盤查資料需占總原物料的85%降至70%，即能得到代表性的生命週期評估結果，可減輕資料蒐集的困難、並節省時間及人力。

PBGA substrates are the key material of semiconductor chips during packaging process. They are the bridge connecting external circuits of the IC chips. Because the PBGA packaging method is a break-through over the original Peripheral Packaging technique, it enables high speed chip function. Besides, It is thinner than the Peripheral Packaging frame, which meets the lighter, thinner, shorter, smaller and good heat dissipation demand of electronic products.

There are lots of different materials and chemicals used in the PBGA process. This study investigates the environmental impact of PBGA product during its life cycle in actual PBGA plants. The input of raw materials, the data of production, the emission of pollutants and the disposal of waste were surveyed in the plants. Then the Life Cycle Assessment and the environment impact were conducted. This study also studies the influence of different layers of the substrates and the different inventory scopes on the results of Life Cycle Assessment. The software used for Life Cycle Assessment is Doitpro, which was developed by Industrial Technology Research Institute. Eco-Indicater95 is used in the environment impact model to quantify and guide the environment impact.

It is found that there are around 2,700 kinds of direct and indirect raw materials used in the PBGA industry. Its complicity is similar to that of semiconductor industry. The largest impact to the environment is the consumption of water resources, followed by the usage of energy resources, and the last is the production of solid waste. The factory without achieving the full capacity is found to consume more energy to maintain its normal operation resulting in larger impact to the environment. Moreover, the study of the muti-layer products has found that the consumption of raw materials and energy resources is reduced per layer of the product, or the loading and impact to the environment are decreased. Therefore, the advanced product with more layers is friendlier to the environment, and it is positive to the development of the PBGA industry. In the analysis of different inventory scopes, it is found that using 70% and 80% of the overall raw materials produces environmental impact results which are within 15 % of those produced by using 100 % raw materials. That is, the difference in the results is small. Therefore for the PBGA product, the commonly requirement of 85 % overall raw materials can be reduced to 70 % to obtain a representative result of life cycle assessment. This can ease the difficulty in information gathering, and it saves time and manpower.