PBGA基板創業關鍵成功因素研究–以A公司為例

Abstract

台灣IC產業自1966年啟萌，最初由後段的封裝製造切入，經過了四分之一世紀的歷練成長，到了1990年初期，眾多廠商競相設立晶圓廠，國內IC產業開始蓬勃發展。多家IC晶圓製造廠陸續的成立，不僅帶動設計、封裝、測試等產業之成長，相關產業如晶圓材料、設備、化學品、光罩等也趁勢興起，使得近年來台灣已成為全球第四大IC產業大國。 本論文研究希望探討在PBGA基板廠商創業關鍵成功因素，因此本論文之研究目的包含PBGA基板創業廠商：(1)關鍵成功因素(2)成功之競爭策略。 本研究採取因子分析法，將54個因子濃縮為13個主要的因子，並針對這13個主要的因子與A公司加以比較，以獲得本研究的結論。 研究結果不僅可供現今PBGA基板的廠商做未來發展及擬定策略方向的參考，由此更可增加廠商投資的成功性，以提昇高科技產業之整體產業競爭力，成功發展高科技產業之營運。

The IC industry of Taiwan started from package in 1966. Up to now, the whole industry chain is strong and complete, including IC design, fabrication, packaging and testing, as well as supporting industries such as materials, equipments, chemicals and photo mask making etc. Taiwan ranks the fourth largest IC production country in global IC industry. The purpose of this study is to explore the key success factors for Start-up Company in PBGA Substrate. The study includes: (1) Key Success Factor (KSF) (2) Successful competitive strategies. This study first use the factor analysis method to screen out 13 major performance factors out of 54 indices. Then, we have a depth interview with A company’s former manager. Finally, we discuss the indices with the results of the interview and make a conclusion. The findings of this research can serve as references to PBGA substrate companies to form their competitive strategies. This model can be extended to other high-tech industries as well.