添加劑對電鍍銅填孔力之影響及利用無電鍍銅製作奈米銅層

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DC Field	Value	Language
dc.contributor.author	羅世儒	en_US
dc.contributor.author	吳樸偉	en_US
dc.date.accessioned	2014-12-12T03:06:00Z	-
dc.date.available	2014-12-12T03:06:00Z	-
dc.date.issued	2006	en_US
dc.identifier.uri	http://140.113.39.130/cdrfb3/record/nctu/#GT009418524	en_US
dc.identifier.uri	http://hdl.handle.net/11536/81171	-
dc.description.abstract	以diamino-triazole、amino-mercapto-thiazol、以及2,5-dimmercapto-1,3,4-thiadiazole三者作為微尺寸銅電鍍的抑制劑，並在具備120nm溝渠的矽晶圓基板上電鍍銅並且觀察添加劑對填孔能力的影響，同時探討銅層的平整度和導電度。其中以diamino-triazole表現最好，可以達成IBM理論中所謂“superfilling”的效果。利用無電鍍的方法在高深寬比的陽極氧化鋁的孔洞陣列中生長厚度為20nm左右的銅層以期長成連續的銅管，從表面形貌、成分分析以及導電度的量測來了解奈米尺度下銅層的形貌。	zh_TW
dc.language.iso	zh_TW	en_US
dc.subject	電鍍	zh_TW
dc.subject	無電鍍	zh_TW
dc.subject	添加劑	zh_TW
dc.subject	填孔	zh_TW
dc.subject	銅	zh_TW
dc.subject	electroplating	en_US
dc.subject	electrodeposition	en_US
dc.subject	electroless	en_US
dc.subject	additives	en_US
dc.subject	filling	en_US
dc.subject	copper	en_US
dc.title	添加劑對電鍍銅填孔力之影響及利用無電鍍銅製作奈米銅層	zh_TW
dc.title	Effects of Additives on Filling Performance in Copper Electroplating and Conformal Copper Deposition in High-Aspect Ratio Trenches by Electroless Plating	en_US
dc.type	Thesis	en_US
dc.contributor.department	材料科學與工程學系	zh_TW
Appears in Collections:	Thesis

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