台灣半導體廠資料包絡法 Malmquist 生產力分析

Abstract

我們以五個指標，應用資料包絡法 (DEA)評量十五家台灣半導體封裝測試廠從2000年到2003年之間生產力的增減變化。為能更精確的量測，我們以差額式評量之模式 (Slacks-based Measurement, SBM) 替代以放射式(Radial-based model) 評量之模式。我們更以超高效模式，達成更精確量測。本研究主要在分析每跨年之間，各公司績效變化的情形，我們藉著摩科斯特(Malmquist) 的四項績效元素結構可獲取下面資訊- 技術上的變化、效率前緣正向移動與負向移動的量測、公司跨周期時的移動過程、以及綜合的生產力。我們的方法對於生產力的變化在管理意涵上有更深入的詮釋，因此能夠解析各公司相對於其他公司競爭力變化的情形。

We use data envelopment analysis (DEA) with five indicators to measure the productivity change of 15 semiconductor packaging and testing firms in Taiwan between years 2000 to 2003. Instead of radial-based model, we use slacks-based measurement (SBM) to have more accurate measurement. Furthermore, super-SBM model is employed to measure the super efficiency. We employ Malmquist productivity measurement to analyze four events for each firm- the technical change, the frontier forward/backward shift, the productivity shift, and comprehensive productivity. Our approach excavates the deeper management implication and provides some new interpretations. Therefore, competitiveness of each firm against others would be realized.