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dc.contributor.authorChang, C. -P.en_US
dc.contributor.authorWu, Y. S.en_US
dc.date.accessioned2014-12-08T15:10:55Z-
dc.date.available2014-12-08T15:10:55Z-
dc.date.issued2008-09-11en_US
dc.identifier.issn0013-5194en_US
dc.identifier.urihttp://dx.doi.org/10.1049/el:20081620en_US
dc.identifier.urihttp://hdl.handle.net/11536/8355-
dc.description.abstractIn this process, amorphous silicon was first transformed to polycrystalline silicon (poly-Si) using a metal-induced lateral crystallisation (MILC) process, followed by annealing with a continuous-wave laser lateral (lambda similar to 532 nm) crystallisation (CLC) with an output power of 3.8 W. MILC-CLC-TFT performed far superior to MILC-TFT. The mobility of the MILC-CLC-TFT was 293 cm(2)/Vs, which was much higher than that of MILC TFTs (54.8 cm(2)/Vs). In addition, MILC-CLC TFTs showed better device uniformity and reliability.en_US
dc.language.isoen_USen_US
dc.titleHigh performance poly-Si TFTs fabricated by continuous-wave laser annealing of metal-induced lateral crystallised silicon filmsen_US
dc.typeArticleen_US
dc.identifier.doi10.1049/el:20081620en_US
dc.identifier.journalELECTRONICS LETTERSen_US
dc.citation.volume44en_US
dc.citation.issue19en_US
dc.citation.spage1157en_US
dc.citation.epageU21en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000259155000036-
dc.citation.woscount2-
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