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dc.contributor.authorChang, Jet Rungen_US
dc.contributor.authorYang, Tsung Hsien_US
dc.contributor.authorKu, Jui Taien_US
dc.contributor.authorShen, Shih Guoen_US
dc.contributor.authorChen, Yi Chengen_US
dc.contributor.authorWong, Yuen Yeeen_US
dc.contributor.authorChang, Chun Yenen_US
dc.date.accessioned2014-12-08T15:11:14Z-
dc.date.available2014-12-08T15:11:14Z-
dc.date.issued2008-07-01en_US
dc.identifier.issn0021-4922en_US
dc.identifier.urihttp://dx.doi.org/10.1143/JJAP.47.5572en_US
dc.identifier.urihttp://hdl.handle.net/11536/8616-
dc.description.abstractIn this study, we examined the growth of a simultaneous AIN/alpha-Si(3)N(4) buffer layer for crack-free GaN growth oil a Si(111) substrate. The compressive stress in the AlN/alpha-Si(3)N(4)/Si(111) structure retards the cracking ill the GaN layer. It is demonstrated that the Al-preseeded layer is a critical factor for accornplishing AlN and the crystalline alpha-Si(3)N(4) layer simultaneously. The effect of Al layer deposition time on the c-axis lattice constants of the subsequent AlN layer, and the effect of the crystalline alpha-Si(3)N(4) layer oil GaN quality were investigated by X-ray diffraction analysis. The 1 : 2 lattice coincidently matches at the alpha-Si(3)N(4)(0001)/Si(111) interface, and the 5 : 2 coincident lattice interface at AlN(0001)/alpha-Si(3)N(4)(0001) reduces the lattice mismatch in the AIN/alpha Si(3)N(4)/Si(111) structure. The 5 : 4 coincident lattice in the AIN/alpha-Si(3)N(4)/Si(111) structure is related to the reduction in the tensile stress in the AIN epilayers. The thickness of crack-free GaN is 2.00 mu m. The full widths at half-maximum (FWHM) of the X-ray rocking curve and neutral-donor-bound exciton (D degrees X) are 1012arcsec and 5.90meV, respectively.en_US
dc.language.isoen_USen_US
dc.titleGaN growth on Si(111) using simultaneous AlN/alpha-Si(3)N(4) buffer structureen_US
dc.typeArticleen_US
dc.identifier.doi10.1143/JJAP.47.5572en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICSen_US
dc.citation.volume47en_US
dc.citation.issue7en_US
dc.citation.spage5572en_US
dc.citation.epage5575en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.department友訊交大聯合研發中心zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.contributor.departmentD Link NCTU Joint Res Ctren_US
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