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dc.contributor.authorChu, Mei-Taien_US
dc.contributor.authorShyu, Joesph Z.en_US
dc.contributor.authorKhosla, R.en_US
dc.date.accessioned2014-12-08T15:11:27Z-
dc.date.available2014-12-08T15:11:27Z-
dc.date.issued2008-06-01en_US
dc.identifier.issn0956-5515en_US
dc.identifier.urihttp://dx.doi.org/10.1007/s10845-008-0079-3en_US
dc.identifier.urihttp://hdl.handle.net/11536/8781-
dc.description.abstractIC Design (fabless) is critical for the global semi-conductor industry. The total revenue of all global fabless firms in 2003 was about US$20 billion, with the top 30 firms earning accounting for 96% of the market share. To examine the leaders in the field, this research analyzes the relative performances of those top 30 fabless firms. Fabless firms are often evaluated based on subjective judgments, and an overall scheme to measure the performance involving objective, multi-input and multi-output criteria is yet to be established. There is also a need for identifying and determining suggestions of how specific firms could improve their performance. Data Envelopment Analysis (DEA) method has been employed in this paper to satisfy the above needs. Using the input and output data of 2003, this study used the DEA method to build a model to evaluate the performance of those global top 30 fabless firms. The current research used four efficiency models: CCR, A&P, BCC, and Cross-Efficiency. To offer a comparison of efficiencies and associated discussions, an analysis of the Scale-Return is provided. Finally, the performance of various fabless firms in 2003 is analyzed. According to the CCR and A&P models, the results showed that the top ten Decision Management Units (DMUs) achieved better operation performance among the 30 leading global fabless firms.en_US
dc.language.isoen_USen_US
dc.subjectperformanceen_US
dc.subjectIC design (fabless)en_US
dc.subjectdata envelopment analysis (DEA)en_US
dc.titleMeasuring the relative performance for leading fabless firms by using data envelopment analysisen_US
dc.typeArticleen_US
dc.identifier.doi10.1007/s10845-008-0079-3en_US
dc.identifier.journalJOURNAL OF INTELLIGENT MANUFACTURINGen_US
dc.citation.volume19en_US
dc.citation.issue3en_US
dc.citation.spage257en_US
dc.citation.epage272en_US
dc.contributor.department科技管理研究所zh_TW
dc.contributor.departmentInstitute of Management of Technologyen_US
dc.identifier.wosnumberWOS:000256080900002-
dc.citation.woscount8-
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