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dc.contributor.authorChung, Chunhuien_US
dc.contributor.authorKorach, Chad S.en_US
dc.contributor.authorKao, Iminen_US
dc.date.accessioned2014-12-08T15:11:28Z-
dc.date.available2014-12-08T15:11:28Z-
dc.date.issued2011-06-01en_US
dc.identifier.issn1087-1357en_US
dc.identifier.urihttp://dx.doi.org/10.1115/1.4004137en_US
dc.identifier.urihttp://hdl.handle.net/11536/8800-
dc.description.abstractIn this paper, the lapping process of wafer surfaces is studied with experiments and contact modeling of surface roughness. In order to improve the performance of the lapping processes, effects of mixed abrasive grits in the slurry of the free abrasive machining (FAM) process are studied using a single-sided wafer-lapping machine. Under the same slurry density, a parametric experimental study employing different mixing ratios of large and small abrasive grits and various normal loadings on the wafer surface applied through a jig is conducted. Observations and measurements of the total amount of material removed, material removal rate, surface roughness, and relative angular velocity are presented as a function of various mixing ratios and loadings and discussed in the paper. The experiments show that the 1:1 mixing ratio of abrasives removes more material than other mixing ratios under the same conditions, with a slightly higher surface roughness. Modeling of the mixed abrasive particle distributions correspondingly indicates that the roughness trend is due to the abrasive size distribution and the particle contact mechanics. The results of this study can provide a good reference to the FAM processes that practitioners use today by exploiting different abrasive mixing ratios in slurry and normal loadings in the manufacturing processes. [DOI: 10.1115/1.4004137]en_US
dc.language.isoen_USen_US
dc.subjectabrasivesen_US
dc.subjectlapping (machining)en_US
dc.subjectmixingen_US
dc.subjectsemiconductor device manufactureen_US
dc.subjectsurface roughnessen_US
dc.titleExperimental Study and Modeling of Lapping Using Abrasive Grits with Mixed Sizesen_US
dc.typeArticleen_US
dc.identifier.doi10.1115/1.4004137en_US
dc.identifier.journalJOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASMEen_US
dc.citation.volume133en_US
dc.citation.issue3en_US
dc.citation.epageen_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000292335200006-
dc.citation.woscount3-
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