銅導線及其障礙層之材質研究

Full metadata record

DC Field	Value	Language
dc.contributor.author	張立	en_US
dc.contributor.author	CHANG LI	en_US
dc.date.accessioned	2014-12-13T10:28:38Z	-
dc.date.available	2014-12-13T10:28:38Z	-
dc.date.issued	2000	en_US
dc.identifier.govdoc	NSC89-2215-E009-028	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/88467	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=525772&docId=95663	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.subject	銅連接線	zh_TW
dc.subject	擴散障礙層	zh_TW
dc.subject	電阻係數	zh_TW
dc.subject	物理氣相沈積法	zh_TW
dc.subject	材料分析	zh_TW
dc.subject	Copper interconnect	en_US
dc.subject	Diffusion barrier	en_US
dc.subject	Resistivity	en_US
dc.subject	Physical vapor deposition	en_US
dc.subject	Material analysis	en_US
dc.title	銅導線及其障礙層之材質研究	zh_TW
dc.title	Materials Study of Diffusion Barriers for Copper Interconnect	en_US
dc.type	Plan	en_US
dc.contributor.department	交通大學材料科學與工程研究所	zh_TW
Appears in Collections:	Research Plans