銅導線及其障礙層之材質研究

完整后设资料纪录

DC 栏位	值	语言
dc.contributor.author	张立	en_US
dc.contributor.author	CHANG LI	en_US
dc.date.accessioned	2014-12-13T10:28:38Z	-
dc.date.available	2014-12-13T10:28:38Z	-
dc.date.issued	2000	en_US
dc.identifier.govdoc	NSC89-2215-E009-028	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/88467	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=525772&docId=95663	en_US
dc.description.sponsorship	行政院国家科学委员会	zh_TW
dc.language.iso	zh_TW	en_US
dc.subject	铜连接线	zh_TW
dc.subject	扩散障碍层	zh_TW
dc.subject	电阻系数	zh_TW
dc.subject	物理气相沈积法	zh_TW
dc.subject	材料分析	zh_TW
dc.subject	Copper interconnect	en_US
dc.subject	Diffusion barrier	en_US
dc.subject	Resistivity	en_US
dc.subject	Physical vapor deposition	en_US
dc.subject	Material analysis	en_US
dc.title	铜导线及其障碍层之材质研究	zh_TW
dc.title	Materials Study of Diffusion Barriers for Copper Interconnect	en_US
dc.type	Plan	en_US
dc.contributor.department	交通大学材料科学与工程研究所	zh_TW
显示于类别：	Research Plans

APA	张., & CHANG L. (2000). 铜导线及其障碍层之材质研究. https://www.grb.gov.tw/search/planDetail?id=525772&docId=95663.
Bibtex	@article{2000, title={铜导线及其障碍层之材质研究}, author={张立 and CHANG LI}, journal={https://www.grb.gov.tw/search/planDetail?id=525772&docId=95663}, year={2000}, url={https://ir.lib.nycu.edu.tw/handle/11536/88467?mode=full}, }