Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 吳耀銓 | en_US |
dc.contributor.author | YEWCHUNG SERMONWU | en_US |
dc.date.accessioned | 2014-12-13T10:29:43Z | - |
dc.date.available | 2014-12-13T10:29:43Z | - |
dc.date.issued | 2000 | en_US |
dc.identifier.govdoc | NSC89-2215-E009-075 | zh_TW |
dc.identifier.uri | http://hdl.handle.net/11536/89575 | - |
dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=574873&docId=107450 | en_US |
dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
dc.language.iso | zh_TW | en_US |
dc.title | 砷化鎵晶片高溫接合中介面空孔之研究 | zh_TW |
dc.title | High-Temperature Healing of Interfacial Voids in GaAs Wafer Bonding | en_US |
dc.type | Plan | en_US |
dc.contributor.department | 國立交通大學材料科學與工程學系 | zh_TW |
Appears in Collections: | Research Plans |