錫鉛銲錫合金的電子飄移研究

標題:	錫鉛銲錫合金的電子飄移研究 A Systematic Study of Electromigration in Sn-Pb Solder Alloys
作者:	陳智 Chen Chih 國立交通大學材料科學與工程學系
關鍵字:	電子遷移;錫鉛銲錫合金;材料性質;Electromigration;Sn-Pb solder alloy;Material property
公開日期:	2000
官方說明文件#:	NSC89-2218-E009-109
URI:	http://hdl.handle.net/11536/89797 https://www.grb.gov.tw/search/planDetail?id=619832&docId=115467
Appears in Collections:	Research Plans

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