Ⅲ-Ⅴ族高頻通訊積體電路及覆晶系統構裝(SiP)新製程發展計畫(Ⅲ)

Title:	Ⅲ-Ⅴ族高頻通訊積體電路及覆晶系統構裝(SiP)新製程發展計畫(Ⅲ)
Authors:	黃瑞彬 HWANG RUEY BING 交通大學電信工程系
Issue Date:	2005
Gov't Doc #:	NSC94-2623-7009-010-IT
URI:	http://hdl.handle.net/11536/90022 https://www.grb.gov.tw/search/planDetail?id=1171950&docId=224004
Appears in Collections:	Research Plans