Ⅲ-Ⅴ族高頻通訊積體電路及覆晶系統構裝(SiP)新製程發展計畫(Ⅲ)

Full metadata record

DC Field	Value	Language
dc.contributor.author	黃瑞彬	en_US
dc.contributor.author	HWANG RUEY BING	en_US
dc.date.accessioned	2014-12-13T10:30:11Z	-
dc.date.available	2014-12-13T10:30:11Z	-
dc.date.issued	2005	en_US
dc.identifier.govdoc	NSC94-2623-7009-010-IT	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/90022	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=1171950&docId=224004	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	Ⅲ-Ⅴ族高頻通訊積體電路及覆晶系統構裝(SiP)新製程發展計畫(Ⅲ)	zh_TW
dc.type	Plan	en_US
dc.contributor.department	交通大學電信工程系	zh_TW
Appears in Collections:	Research Plans