以自組裝奈米孔洞SiO2作為次70 nm IC技術之超低介電薄膜之應用研究(II)

Title:	以自組裝奈米孔洞SiO2作為次70 nm IC技術之超低介電薄膜之應用研究(II) Self-Assembly Nanoporous Silica as an Ultra-Low K Dielectric for Sub-70 nm IC Technologies(II)
Authors:	潘扶民 PAN FU-MING 交通大學材料科學與工程系
Issue Date:	2004
Gov't Doc #:	NSC93-2215-E009-028
URI:	http://hdl.handle.net/11536/90913 https://www.grb.gov.tw/search/planDetail?id=1026685&docId=195178
Appears in Collections:	Research Plans

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