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以自組裝奈米孔洞SiO2作為次70 nm IC技術之超低介電薄膜之應用研究(II)
以自組裝奈米孔洞SiO2作為次70 nm IC技術之超低介電薄膜之應用研究(II)
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932215E009028.pdf
(322.92 KB)
Date
2004
Authors
潘扶民
PAN FU-MING
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https://www.grb.gov.tw/search/planDetail?id=1026685&docId=195178
https://ir.lib.nycu.edu.tw/handle/11536/90913
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