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dc.contributor.authorChen, Shih-Chengen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorChen, Wei-Renen_US
dc.contributor.authorLo, Yuan-Chunen_US
dc.contributor.authorWu, Kai-Tingen_US
dc.contributor.authorSze, S. M.en_US
dc.contributor.authorChen, Jasonen_US
dc.contributor.authorLiao, I. H.en_US
dc.contributor.authorYeh (Huang), Fon-Shanen_US
dc.date.accessioned2014-12-08T15:11:54Z-
dc.date.available2014-12-08T15:11:54Z-
dc.date.issued2011-03-31en_US
dc.identifier.issn0040-6090en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.tsf.2011.01.259en_US
dc.identifier.urihttp://hdl.handle.net/11536/9118-
dc.description.abstractThis study focuses on the influence of a hydrogen plasma treatment on electrical properties of tungsten nanocrystal nonvolatile memory. The X-ray photon emission spectra show that, after the hydrogen plasma treatment, a change in binding energy occurs such that Si(x+) and Si(y+) peaks appear at a position that is shifted about 2.3 and 3.3 eV from Si(o+) in Si 2p spectra. This indicates that Si dangling bonds are passivated to form a Si-H bond structure in the SiO(2). Furthermore, the transmission electron microscopy shows cross-sectional and plane-view for the nanocrystal microstructure after the hydrogen plasma treatment. Electrical measurement analyses show improved data retention because the hydrogen plasma treatment enhances the quality of the oxide surrounding the nanocrystals. The endurance and retention properties of the memory device are improved by about 36% and 30%, respectively. (C) 2011 Elsevier By. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectHydrogen plasmaen_US
dc.subjectTungsten nanoclystalsen_US
dc.subjectNonvolatile memoryen_US
dc.subjectX-ray photoelectron spectroscopyen_US
dc.titleInfluence of hydrogen plasma treatment on charge storage characteristics in high density tungsten nanocrystal nonvolatile memoryen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.tsf.2011.01.259en_US
dc.identifier.journalTHIN SOLID FILMSen_US
dc.citation.volume519en_US
dc.citation.issue11en_US
dc.citation.spage3897en_US
dc.citation.epage3901en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000289333400081-
dc.citation.woscount3-
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