電磁干擾下金屬空腔內印刷電路之電磁耦合分析與模擬

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DC Field	Value	Language
dc.contributor.author	黃瑞彬	en_US
dc.contributor.author	HWANG RUEY BING	en_US
dc.date.accessioned	2014-12-13T10:32:33Z	-
dc.date.available	2014-12-13T10:32:33Z	-
dc.date.issued	2004	en_US
dc.identifier.govdoc	NSC93-2623-7009-017	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/91611	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=902707&docId=171632	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	電磁干擾下金屬空腔內印刷電路之電磁耦合分析與模擬	zh_TW
dc.title	Investigation on the Electromagnetic Interference on Printed Circuit Board in a Metal Cavity	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學電信工程學系(所)	zh_TW
Appears in Collections:	Research Plans

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