電磁干擾下金屬空腔內印刷電路之電磁耦合分析與模擬

標題:	電磁干擾下金屬空腔內印刷電路之電磁耦合分析與模擬 Investigation on the Electromagnetic Interference on Printed Circuit Board in a Metal Cavity
作者:	黃瑞彬 HWANG RUEY BING 國立交通大學電信工程學系(所)
公開日期:	2004
官方說明文件#:	NSC93-2623-7009-017
URI:	http://hdl.handle.net/11536/91611 https://www.grb.gov.tw/search/planDetail?id=902707&docId=171632
Appears in Collections:	Research Plans

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