完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Wang, Y. P. | en_US |
dc.contributor.author | Hsu, R. Q. | en_US |
dc.contributor.author | Wul, C. W. | en_US |
dc.date.accessioned | 2014-12-08T15:02:14Z | - |
dc.date.available | 2014-12-08T15:02:14Z | - |
dc.date.issued | 2008 | en_US |
dc.identifier.isbn | 978-0-7918-4294-2 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/919 | - |
dc.identifier.uri | http://dx.doi.org/10.1115/MicroNano2008-70235 | en_US |
dc.description.abstract | Conventional shock sensors typically use mechanisms such as cantilever beams or axial springs as triggering devices. Reaction time for these conventional shock sensors are either far too slow or, in many cases, fail to function completely for high G (> 300G) applications. In this study, a non-powered MEMS high G shock sensor with a measurement range of 3,000-21,000 G is presented. The triggering mechanism is a combination of cantilever and spring structure. The design of the mechanism underwent a series of analyses. Simulation and test results indicated that a MEMS high G shock sensor has a faster reaction time than conventional G shock sensors that use a cantilever beam or spring mechanism. Furthermore, the MEMS high G shock sensor is sufficiently robust to survive the impact encountered in high G application where most conventional G shock sensors fail. | en_US |
dc.language.iso | en_US | en_US |
dc.title | DESIGN OF A NON-POWERED MEMS HIGH G SHOCK SENSOR | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.doi | 10.1115/MicroNano2008-70235 | en_US |
dc.identifier.journal | MicroNano2008-2nd International Conference on Integration and Commercialization of Micro and Nanosystems, Proceedings | en_US |
dc.citation.spage | 87 | en_US |
dc.citation.epage | 96 | en_US |
dc.contributor.department | 機械工程學系 | zh_TW |
dc.contributor.department | Department of Mechanical Engineering | en_US |
dc.identifier.wosnumber | WOS:000262479800017 | - |
顯示於類別: | 會議論文 |