以ICP-RIE配合複合奈米強化微電鑄之LIGA法製作高寬深比合金模仁之微結構與機械性質

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DC Field	Value	Language
dc.contributor.author	涂肇嘉	en_US
dc.date.accessioned	2014-12-13T10:34:53Z	-
dc.date.available	2014-12-13T10:34:53Z	-
dc.date.issued	2002	en_US
dc.identifier.govdoc	NSC91-2216-E009-020	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/93060	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=785491&docId=151051	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	以ICP-RIE配合複合奈米強化微電鑄之LIGA法製作高寬深比合金模仁之微結構與機械性質	zh_TW
dc.title	The Microstructure and Mechanical Property of High Aspect Ratio Mold Insert by LIGA Method of ICP-RIE with Nano-Strengthened Composite Microelectroplating	en_US
dc.type	Plan	en_US
dc.contributor.department	交通大學材料科學與工程系	zh_TW
Appears in Collections:	Research Plans

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