完整後設資料紀錄
| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.author | 柯明道 | en_US |
| dc.contributor.author | KER MING-DOU | en_US |
| dc.date.accessioned | 2014-12-13T10:35:44Z | - |
| dc.date.available | 2014-12-13T10:35:44Z | - |
| dc.date.issued | 2001 | en_US |
| dc.identifier.govdoc | NSC90-2215-E009-053 | zh_TW |
| dc.identifier.uri | http://hdl.handle.net/11536/93575 | - |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=665649&docId=126360 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.language.iso | zh_TW | en_US |
| dc.subject | 射頻積體電路 | zh_TW |
| dc.subject | 靜電放電 | zh_TW |
| dc.subject | 靜電防護 | zh_TW |
| dc.subject | 高頻 | zh_TW |
| dc.subject | Radio frequency integrated circuit (RF IC) | en_US |
| dc.subject | Electrostatic discharge (ESD) | en_US |
| dc.subject | Electrostatic protection | en_US |
| dc.subject | High frequency | en_US |
| dc.title | 適用於GHz頻段之輸出入靜電放電防護技術與銲墊設計 | zh_TW |
| dc.title | Electrostatic Discharge (ESD) Protection and Low-Capacitance Bond Pad for GHz RF Integrated Circuits | en_US |
| dc.type | Plan | en_US |
| dc.contributor.department | 交通大學電子工程研究所 | zh_TW |
| 顯示於類別： | 研究計畫 | |
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