子高性能材料之銲接與修補製程最佳化研究---計畫二：銅接合--低介電材料介電層之界面可靠度提升研究(II)

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DC Field	Value	Language
dc.contributor.author	邱碧秀	en_US
dc.contributor.author	CHIOU BI-SHIOU	en_US
dc.date.accessioned	2014-12-13T10:36:05Z	-
dc.date.available	2014-12-13T10:36:05Z	-
dc.date.issued	2000	en_US
dc.identifier.govdoc	NSC89-2216-E009-038	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/93774	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=584712&docId=109911	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	子高性能材料之銲接與修補製程最佳化研究---計畫二：銅接合--低介電材料介電層之界面可靠度提升研究(II)	zh_TW
dc.title	Reliability Enhancement for Copper Interconnect-Low K Dielectric Interconnect(Ⅱ)	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學電子工程學系	zh_TW
Appears in Collections:	Research Plans

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