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dc.contributor.author吳文發en_US
dc.date.accessioned2014-12-13T10:37:06Z-
dc.date.available2014-12-13T10:37:06Z-
dc.date.issued1999en_US
dc.identifier.govdocNSC88-2215-E317-001zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/94382-
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=428974&docId=76776en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.language.isozh_TWen_US
dc.subject深次微米zh_TW
dc.subject鋁栓zh_TW
dc.subject多層互連zh_TW
dc.subject平坦化zh_TW
dc.subject擴散障礙層zh_TW
dc.subject電漿處理zh_TW
dc.subject接觸電阻zh_TW
dc.subject鋁濺鍍zh_TW
dc.subjectDeep submicrometeren_US
dc.subjectAl plugen_US
dc.subjectMultilevel interconnecten_US
dc.subjectPlanarizationen_US
dc.subjectDiffusion barrieren_US
dc.subjectPlasma treatmenten_US
dc.subjectContact resistanceen_US
dc.subjectAl sputteringen_US
dc.title鋁栓塞製程於深次微米元件之應用研究(II)zh_TW
dc.titleApplications of Al Plug for Deep Sub-Micron Devices (II)en_US
dc.typePlanen_US
dc.contributor.department國立交通大學毫微米實驗室zh_TW
Appears in Collections:Research Plans