無線通訊用積層微波陶瓷元件之研發---子計畫II：高頻用積層微波材及界面電極研究(II)

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	陳三元	en_US
dc.contributor.author	CHEN SAN-YUAN	en_US
dc.date.accessioned	2014-12-13T10:37:11Z	-
dc.date.available	2014-12-13T10:37:11Z	-
dc.date.issued	1999	en_US
dc.identifier.govdoc	NSC88-2213-E009-131	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/94449	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=444162&docId=80432	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.subject	微波元件	zh_TW
dc.subject	無線通訊	zh_TW
dc.subject	內電極	zh_TW
dc.subject	溶膠凝膠法	zh_TW
dc.subject	低溫共燒	zh_TW
dc.subject	Microwave device	en_US
dc.subject	Wireless communication	en_US
dc.subject	Internal electrode	en_US
dc.subject	Sol-Gel process	en_US
dc.subject	Low-temperature co-firing	en_US
dc.title	無線通訊用積層微波陶瓷元件之研發---子計畫II：高頻用積層微波材及界面電極研究(II)	zh_TW
dc.title	Multilayer Microwave Materials and Internal Electrode for High Frequency Communication Devices (II)	en_US
dc.type	Plan	en_US
dc.contributor.department	交通大學材料科學與工程研究所	zh_TW
顯示於類別：	研究計畫