完整後設資料紀錄
DC 欄位語言
dc.contributor.author陳三元en_US
dc.contributor.authorCHEN SAN-YUANen_US
dc.date.accessioned2014-12-13T10:37:11Z-
dc.date.available2014-12-13T10:37:11Z-
dc.date.issued1999en_US
dc.identifier.govdocNSC88-2213-E009-131zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/94449-
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=444162&docId=80432en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.language.isozh_TWen_US
dc.subject微波元件zh_TW
dc.subject無線通訊zh_TW
dc.subject內電極zh_TW
dc.subject溶膠凝膠法zh_TW
dc.subject低溫共燒zh_TW
dc.subjectMicrowave deviceen_US
dc.subjectWireless communicationen_US
dc.subjectInternal electrodeen_US
dc.subjectSol-Gel processen_US
dc.subjectLow-temperature co-firingen_US
dc.title無線通訊用積層微波陶瓷元件之研發---子計畫II:高頻用積層微波材及界面電極研究(II)zh_TW
dc.titleMultilayer Microwave Materials and Internal Electrode for High Frequency Communication Devices (II)en_US
dc.typePlanen_US
dc.contributor.department交通大學材料科學與工程研究所zh_TW
顯示於類別:研究計畫