超大型積體電路中連接導線之銅材及障礙層微結構及特性研究

Full metadata record

DC Field	Value	Language
dc.contributor.author	張立	en_US
dc.contributor.author	CHANG LI	en_US
dc.date.accessioned	2014-12-13T10:37:12Z	-
dc.date.available	2014-12-13T10:37:12Z	-
dc.date.issued	1999	en_US
dc.identifier.govdoc	NSC88-2215-E009-027	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/94455	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=444285&docId=80462	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.subject	金屬化	zh_TW
dc.subject	擴散阻礙	zh_TW
dc.subject	濺鍍	zh_TW
dc.subject	銅	zh_TW
dc.subject	Metallization	en_US
dc.subject	Diffusion barrier	en_US
dc.subject	Sputtering	en_US
dc.subject	Copper	en_US
dc.title	超大型積體電路中連接導線之銅材及障礙層微結構及特性研究	zh_TW
dc.title	Microstructural Study of Copper and Its Alloys for Interconnect Application in ULSI	en_US
dc.type	Plan	en_US
dc.contributor.department	交通大學材料科學與工程研究所	zh_TW
Appears in Collections:	Research Plans

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