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dc.contributor.authorChen, Wei-Renen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorYeh, Jui-Lungen_US
dc.contributor.authorSze, S. M.en_US
dc.contributor.authorChang, Chun-Yenen_US
dc.date.accessioned2014-12-08T15:12:18Z-
dc.date.available2014-12-08T15:12:18Z-
dc.date.issued2008-04-14en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.2905812en_US
dc.identifier.urihttp://hdl.handle.net/11536/9454-
dc.description.abstractThe authors provided the reliability characteristics of nonvolatile nickel-silicide nanocrystal memories embedded in oxide and nitride layers for next-generation nonvolatile memory application. The charge trapping layer was deposited by sputtering a commixed target in the argon and oxygen/nitrogen ambiances, and then using a low temperature rapid thermal annealing to form nanocrystals. Transmission electron microscope clearly shows the sharpness and the density of nanocrystals. These proposed memory structures were compared for the charge storage ability, retention, and endurance. In addition, we used a simple simulation of electric field for nonvolatile nanocrystals memory to explain the advantages by using the high-k dielectric. (C) 2008 American Institute of Physics.en_US
dc.language.isoen_USen_US
dc.titleReliability characteristics of NiSi nanocrystals embedded in oxide and nitride layers for nonvolatile memory applicationen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.2905812en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume92en_US
dc.citation.issue15en_US
dc.citation.epageen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000255117100049-
dc.citation.woscount31-
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