完整後設資料紀錄
DC 欄位語言
dc.contributor.authorChung, Shu-Hsingen_US
dc.contributor.authorHsieh, Ming-Hsiuen_US
dc.date.accessioned2014-12-08T15:12:20Z-
dc.date.available2014-12-08T15:12:20Z-
dc.date.issued2008-04-01en_US
dc.identifier.issn0360-8352en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.cie.2007.09.009en_US
dc.identifier.urihttp://hdl.handle.net/11536/9489-
dc.description.abstractWafer manufacturers must make decisions regarding tool elimination due to changes caused by demand, product mixes, and overseas fab capacity expansion. Such a problem is raised by leading semiconductor manufacturers in Taiwan. This paper is aimed at developing a sound mechanism for tool portfolio elimination based on determining which equipment can be pruned. In the proposed mechanism, product mix, wafer output, capital expenditure, tool utilization, protective capacity, and cycle time are taken into the overall evaluation. This paper develops an integer programming model to avoid trial-and-error and to obtain the optimal solution. Compared to the current industry approach, the results show that the proposed mechanism can effectively identify the correct tools for elimination with a large capital savings and little cycle time impact. (C) 2007 Elsevier Ltd. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjecttool portfolioen_US
dc.subjectcapacity planningen_US
dc.subjectsemiconductoren_US
dc.titleLong-term tool elimination planning for a wafer faben_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.cie.2007.09.009en_US
dc.identifier.journalCOMPUTERS & INDUSTRIAL ENGINEERINGen_US
dc.citation.volume54en_US
dc.citation.issue3en_US
dc.citation.spage589en_US
dc.citation.epage601en_US
dc.contributor.department工業工程與管理學系zh_TW
dc.contributor.departmentDepartment of Industrial Engineering and Managementen_US
dc.identifier.wosnumberWOS:000254157500018-
dc.citation.woscount6-
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