微波頻段球柵陣列封裝基板與嵌入式被動元件技術之開發

Full metadata record

DC Field	Value	Language
dc.contributor.author	吳霖？	en_US
dc.contributor.author	WU LIN-KUN	en_US
dc.date.accessioned	2014-12-13T10:37:55Z	-
dc.date.available	2014-12-13T10:37:55Z	-
dc.date.issued	2001	en_US
dc.identifier.govdoc	NSC90-2213-E009-065	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/94943	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=663556&docId=125801	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.subject	微波	zh_TW
dc.subject	球柵陣列	zh_TW
dc.subject	被動元件	zh_TW
dc.subject	Microwave	en_US
dc.subject	BGA	en_US
dc.subject	Passive element	en_US
dc.title	微波頻段球柵陣列封裝基板與嵌入式被動元件技術之開發	zh_TW
dc.title	Development of Technologies for Microwave BGA Package Substrates and Embedded Passives	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學電信工程學系	zh_TW
Appears in Collections:	Research Plans

Files in This Item:

If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.