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dc.contributor.author陳茂傑en_US
dc.date.accessioned2014-12-13T10:37:58Z-
dc.date.available2014-12-13T10:37:58Z-
dc.date.issued2001en_US
dc.identifier.govdocNSC90-2215-E009-096zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/94987-
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=665788&docId=126395en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.language.isozh_TWen_US
dc.subject化學氣相沈積法zh_TW
dc.subject銅膜zh_TW
dc.subject積體電路製造zh_TW
dc.subjectCVDen_US
dc.subjectCopper filmen_US
dc.subjectIntegrated circuit fabricationen_US
dc.title實用銅膜之化學氣相沈積技術研究zh_TW
dc.titleStudy and Development of Practical Copper Film Deposition by CVD Methoden_US
dc.typePlanen_US
dc.contributor.department交通大學電子工程系zh_TW
顯示於類別:研究計畫