Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 吳耀銓 | en_US |
dc.contributor.author | WU YEWCHUNG SERMON | en_US |
dc.date.accessioned | 2014-12-13T10:38:19Z | - |
dc.date.available | 2014-12-13T10:38:19Z | - |
dc.date.issued | 2013 | en_US |
dc.identifier.govdoc | NSC101-2221-E009-053-MY3 | zh_TW |
dc.identifier.uri | http://hdl.handle.net/11536/95245 | - |
dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=2851744&docId=403948 | en_US |
dc.description.abstract | 本計畫是利用人工鑽石顆粒的高導熱性質,製作出高散熱基板。取代原有的LED 基板,進而改善高功率發光二極體在高電流驅動下的散熱問題。其中(1)利用大尺寸 (~200μm)的鑽石顆粒,以有效的利用鑽石的高導熱性質。加上(2)則是利用圖案化的 結構化矽,裸露出矽走道做為切割區域,將可避開直接切割到鑽石導致的問題。 | zh_TW |
dc.description.abstract | This project is about fabricating high thermal conductivity diamond/Si composite substrate to replace LED substrate. (1) Using 200μm artificial diamond particles to increase substrate thermal conductivity. (2)Using “structure” Si substrate to define the cutting path for LED devices. | en_US |
dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
dc.language.iso | zh_TW | en_US |
dc.subject | 人工鑽石顆粒 | zh_TW |
dc.subject | 晶圓接合 | zh_TW |
dc.subject | 圖案化的結構化矽 | zh_TW |
dc.subject | Artificial diamond particles | en_US |
dc.subject | wafer bonding processes | en_US |
dc.subject | structure Si | en_US |
dc.title | 利用鑽石矽複合基板以製作高散熱的高功率發光二極體 | zh_TW |
dc.title | Using diamond/Si composite substrate for high power LEDs | en_US |
dc.type | Plan | en_US |
dc.contributor.department | 國立交通大學材料科學與工程學系(所) | zh_TW |
Appears in Collections: | Research Plans |