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完整后设资料纪录
DC 栏位值语言
dc.contributor.author吴耀铨en_US
dc.contributor.authorWU YEWCHUNG SERMONen_US
dc.date.accessioned2014-12-13T10:38:19Z-
dc.date.available2014-12-13T10:38:19Z-
dc.date.issued2013en_US
dc.identifier.govdocNSC101-2221-E009-053-MY3zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/95245-
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=2851744&docId=403948en_US
dc.description.abstract本计画是利用人工钻石颗粒的高导热性质，制作出高散热基板。取代原有的LED
基板，进而改善高功率发光二极体在高电流驱动下的散热问题。其中（1）利用大尺寸
(~200μm)的钻石颗粒，以有效的利用钻石的高导热性质。加上（2）则是利用图案化的
结构化矽，裸露出矽走道做为切割区域，将可避开直接切割到钻石导致的问题。		zh_TW
dc.description.abstractThis project is about fabricating high thermal conductivity diamond/Si composite
substrate to replace LED substrate. (1) Using 200μm artificial diamond particles to increase
substrate thermal conductivity. (2)Using “structure” Si substrate to define the cutting path for
LED devices.		en_US
dc.description.sponsorship行政院国家科学委员会zh_TW
dc.language.isozh_TWen_US
dc.subject人工钻石颗粒zh_TW
dc.subject晶圆接合zh_TW
dc.subject图案化的结构化矽zh_TW
dc.subjectArtificial diamond particlesen_US
dc.subjectwafer bonding processesen_US
dc.subjectstructure Sien_US
dc.title利用钻石矽复合基板以制作高散热的高功率发光二极体zh_TW
dc.titleUsing diamond/Si composite substrate for high power LEDsen_US
dc.typePlanen_US
dc.contributor.department国立交通大学材料科学与工程学系（所）zh_TW
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