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dc.contributor.authorHuang, Jiun-Jiaen_US
dc.contributor.authorChang, Chia-Wenen_US
dc.contributor.authorDneg, Chih-Kangen_US
dc.contributor.authorLei, Tan-Fuen_US
dc.date.accessioned2014-12-08T15:12:26Z-
dc.date.available2014-12-08T15:12:26Z-
dc.date.issued2007en_US
dc.identifier.urihttp://hdl.handle.net/11536/9556-
dc.description.abstractPolycrystalline silicon thin-film transistors (poly-Si TFTs) with fluorinated silicate glass (FSG) inter-layer dielectric (ILD) passivation layer were proposed in this study. The outdiffused fluorine atoms from FSG ILD could replace Si dangling bonds at grain boundaries in poly-Si film. The proposed short-channel poly-Si TFTs with FSG ILD passivation have electrical enhancement, including on current, off current, and kink effect, compared to those with undoped SiO2 ILD passivation.en_US
dc.language.isoen_USen_US
dc.titleElectrical enhancement of poly-Si TFTs using FSG ILD passivationen_US
dc.typeProceedings Paperen_US
dc.identifier.journalIDW '07: PROCEEDINGS OF THE 14TH INTERNATIONAL DISPLAY WORKSHOPS, VOLS 1-3en_US
dc.citation.spage1881en_US
dc.citation.epage1884en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000258483900488-
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