銲錫接點熱疲乏斷裂之研究---無鉛焊錫(II)

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	邱碧秀	en_US
dc.contributor.author	CHIOU BI-SHIOU	en_US
dc.date.accessioned	2014-12-13T10:38:45Z	-
dc.date.available	2014-12-13T10:38:45Z	-
dc.date.issued	1996	en_US
dc.identifier.govdoc	NSC85-2215-E009-066	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/95644	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=230177&docId=41820	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.subject	電子構裝	zh_TW
dc.subject	可靠度	zh_TW
dc.subject	焊錫接點	zh_TW
dc.subject	熱疲乏	zh_TW
dc.subject	無鉛焊錫	zh_TW
dc.subject	Electronic package	en_US
dc.subject	Reliability	en_US
dc.subject	Solder joint	en_US
dc.subject	Thermal fatigue	en_US
dc.subject	Unlead solder	en_US
dc.title	銲錫接點熱疲乏斷裂之研究---無鉛焊錫(II)	zh_TW
dc.title	Thermal Fatigue Fracture of Solder Joint---Unlead Solder(II)	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學電子工程學系	zh_TW
顯示於類別：	研究計畫