封裝微帶線電路中部分封閉吸收性共振腔之分析

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	鍾世忠	en_US
dc.contributor.author	CHUNG SHYH-JONG	en_US
dc.date.accessioned	2014-12-13T10:39:05Z	-
dc.date.available	2014-12-13T10:39:05Z	-
dc.date.issued	1996	en_US
dc.identifier.govdoc	NSC85-2213-E009-001	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/96061	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=238191&docId=43992	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.subject	封裝微帶線	zh_TW
dc.subject	高階模	zh_TW
dc.subject	金屬隔板	zh_TW
dc.subject	吸收性共振腔	zh_TW
dc.subject	Packaged microstrip circuit	en_US
dc.subject	Higher-order mode	en_US
dc.subject	Metal diaphragm	en_US
dc.subject	Absorbingcavity	en_US
dc.title	封裝微帶線電路中部分封閉吸收性共振腔之分析	zh_TW
dc.title	Analysis of a Partially Sealed Absorbing Cavity in a Packaged Microstrip Circuit	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學電信工程學系	zh_TW
顯示於類別：	研究計畫