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DC FieldValueLanguage
dc.contributor.author張隆國en_US
dc.date.accessioned2014-12-13T10:39:07Z-
dc.date.available2014-12-13T10:39:07Z-
dc.date.issued1996en_US
dc.identifier.govdocNSC85-2213-E009-102zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/96091-
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=225618&docId=40546en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.language.isozh_TWen_US
dc.subjectSPICEzh_TW
dc.subject印刷電路板zh_TW
dc.subject熱傳導zh_TW
dc.subject熱對流zh_TW
dc.subject熱輻射zh_TW
dc.subject有限差分法zh_TW
dc.subjectSPICEen_US
dc.subjectPrinted circuit boarden_US
dc.subjectThermal conductionen_US
dc.subjectThermal convectionen_US
dc.subjectThermalradiationen_US
dc.subjectFinite difference methoden_US
dc.titleSPICE上多網目式電路板溫度模擬模式之建立zh_TW
dc.titleThe Multi-Meshed Temperature Model of PCB in SPICEen_US
dc.typePlanen_US
dc.contributor.department國立交通大學控制工程學系zh_TW
Appears in Collections:Research Plans


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