SPICE上多網目式電路板溫度模擬模式之建立

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	張隆國	en_US
dc.date.accessioned	2014-12-13T10:39:07Z	-
dc.date.available	2014-12-13T10:39:07Z	-
dc.date.issued	1996	en_US
dc.identifier.govdoc	NSC85-2213-E009-102	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/96091	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=225618&docId=40546	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.subject	SPICE	zh_TW
dc.subject	印刷電路板	zh_TW
dc.subject	熱傳導	zh_TW
dc.subject	熱對流	zh_TW
dc.subject	熱輻射	zh_TW
dc.subject	有限差分法	zh_TW
dc.subject	SPICE	en_US
dc.subject	Printed circuit board	en_US
dc.subject	Thermal conduction	en_US
dc.subject	Thermal convection	en_US
dc.subject	Thermalradiation	en_US
dc.subject	Finite difference method	en_US
dc.title	SPICE上多網目式電路板溫度模擬模式之建立	zh_TW
dc.title	The Multi-Meshed Temperature Model of PCB in SPICE	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學控制工程學系	zh_TW
顯示於類別：	研究計畫