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dc.contributor.authorChen, Wei-Renen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorYeh, Jui-Lungen_US
dc.contributor.authorChang, Chun-Yenen_US
dc.contributor.authorChen, Shih-Chingen_US
dc.date.accessioned2014-12-08T15:12:35Z-
dc.date.available2014-12-08T15:12:35Z-
dc.date.issued2008-02-11en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.2841049en_US
dc.identifier.urihttp://hdl.handle.net/11536/9677-
dc.description.abstractThe formation of Ni-Si and Ni-N nanocrystals by sputtering a Ni(0.3)Si(0.7) target in argon and nitrogen environment were proposed in this paper. A transmission electron microscope analysis shows the nanocrystals embedded in the nitride layer. X-ray photoelectron spectroscopy and x-ray diffraction also offer the chemical material analysis of nanocrystals with surrounding dielectric and the crystallization of nanocrystals for different thermal annealing treatments. Nonvolatile Ni-Si nanocrystal memories reveal superior electrical characteristics for charge storage capacity and reliability due to the improvement of thermal annealing treatment. In addition, we used energy band diagrams to explain the significance of surrounding dielectric for reliability. (c) 2008 American Institute of Physics.en_US
dc.language.isoen_USen_US
dc.titleNonvolatile memory characteristics influenced by the different crystallization of Ni-Si and Ni-N nanocrystalsen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.2841049en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume92en_US
dc.citation.issue6en_US
dc.citation.epageen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000253237900048-
dc.citation.woscount2-
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