球柵矩陣型積體電路焊線製程參數最佳化之設計

Full metadata record

DC Field	Value	Language
dc.contributor.author	蘇朝墩	en_US
dc.contributor.author	SU CHAO-TON	en_US
dc.date.accessioned	2014-12-13T10:39:45Z	-
dc.date.available	2014-12-13T10:39:45Z	-
dc.date.issued	2001	en_US
dc.identifier.govdoc	NSC90-2218-E009-008	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/96785	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=674233&docId=128513	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.subject	引線接合	zh_TW
dc.subject	球柵矩陣型積體電路	zh_TW
dc.subject	製程設計	zh_TW
dc.subject	最佳化	zh_TW
dc.subject	Wire bonding	en_US
dc.subject	BGA	en_US
dc.subject	Process design	en_US
dc.subject	Optimization	en_US
dc.title	球柵矩陣型積體電路焊線製程參數最佳化之設計	zh_TW
dc.title	An Intelligent Approach for Simultaneous Optimization of a BGA Wire Bonding Process	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學工業工程與管理學系	zh_TW
Appears in Collections:	Research Plans

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