球柵矩陣型積體電路焊線製程參數最佳化之設計

標題:	球柵矩陣型積體電路焊線製程參數最佳化之設計 An Intelligent Approach for Simultaneous Optimization of a BGA Wire Bonding Process
作者:	蘇朝墩 SU CHAO-TON 國立交通大學工業工程與管理學系
關鍵字:	引線接合;球柵矩陣型積體電路;製程設計;最佳化;Wire bonding;BGA;Process design;Optimization
公開日期:	2001
官方說明文件#:	NSC90-2218-E009-008
URI:	http://hdl.handle.net/11536/96785 https://www.grb.gov.tw/search/planDetail?id=674233&docId=128513
Appears in Collections:	Research Plans

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